DJ-8MPLUS-CORE core board is based on NXP embedded multi-core application processor i.MX 8M Plus series processor, integrating quad-core or dual-core Arm® Cortex®-A53 processor, with neural processing unit (NPU), the computer power up to 2.3 TOPS. This series of processors focuses on machine learning and vision, advanced multimedia, and highly reliable industrial automation. It aims to meet the needs of smart home, building, urban and industrial 4.0 applications.

DJ-8MPLUS-CORE core board adopts a high TG HDI board design, which is compatible with the full series of processors of NXP company i.MX8M Plus, integrates CPU, LPDDR4, eMMC, PMU, QSPI, and is connected to the bottom plate through four high-precision industrial-grade sockets, with the characteristics of high reliability and easy installation. The size of the core board is only 48mm*56mm, and its design meets the design needs of various industries.

DJ-8MPLUS-CORE core board is equipped with Android and Linux software operating systems, which can be widely used in industrial control, medical instruments, communication control, traffic control, information systems, financial equipment, automobiles, digital control, military industry and various terminal markets.

DJ-8MPLUS-CORE core board defaults to an industrial-grade core board, which can run stably in the temperature range of -40℃~85℃. According to the different needs of customers, a variety of different configurations are provided for users to choose from, and customized services can also be provided according to customer needs.

Features

● Based on NXP i.MX 8M Plus chip, it integrates 4 or 2 Cortex-A53, frequency up to 1.8 GHz; 1 Cortex-M7, frequency up to 800 MHz; chip-in neural processing unit (NPU), computer up to 2.3 TOPs

● Integrated minimum system: main processor, LPDDR4 SDRAM, eMMC, PMU

● Rich application interfaces: USB, UART, dual Gigabit Ethernet, SDIO, I2C, GPIO, CAN FD, AUDIO, LVDS, MIPI, HDMI etc.

● Supports Linux and Android operating systems, provides API DEMO code, and supports customer upper-level application APP development

● Smaller size: 48mm*56mm, HDI sinking gold PCB board process

● Wide temperature working range: -40℃~80℃